ISLPED'13
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International Symposium on Low Power Electronics and Design
Beijing, China Sept 4-6, 2013
Technical Program Committee
1. Architecture, Circuits, and Technology
1.1 Technologies and Digital Circuits
Wayne Burleson, University of Massachusetts (
subcommittee co-chair
)
Naveen Verma, Princeton (
subcommittee co-chair
)
Benton Calhoun, University of Virginia
Kevin Cao, Arizona State University
Vikas Chandra, ARM
Swaroop Ghosh, University of South Florida
Mingoo Seok, Columbia University
Jinfeng Kang, Peking University
Jaydeep Kulkarni, Intel
Joyce Kwong, Texas Instruments
Hamid Mahmoodi, San Francisco State University
Saibal Mukhopadhyay, Georgia Tech
Jae Sun Seo, IBM T. J. Watson Research Center
Srini Sridhara, Texas Instruments
SengOon Toh, AMD
Carlos Tokunaga, Intel
Lan Wei, Altera
Jason Woo, UCLA
Matthew Ziegler, IBM TJ Watson
1.2 Logic and Microarchitecture Design
Hans Jacobson, IBM (
subcommittee co-hair
)
Hai (Helen) Li, NYU Polytech (
subcommittee co-chair
)
Yasuko Eckert, AMD
David Garrett, Broadcom
Nuwan Jayasena, AMD
Soontae Kim, KAIST
Nam Sung Kim, University of Wisconsin
Masaaki Kondo, University of Electro-Communications
Xiaoyao Liang, Shanghai Jiaotong University
Hiroshi Nakamura, The University of Tokyo
Sandeep Navada, North Carolina State University
Guangyu Sun, Peking University
Thomas Wenisch, University of Michigan
Shujie Zhang, Huawei
Antonia Zhai, University of Minnesota
Sheng Li, Hewlett-Packard
Zhiyi Yu, Fudan University
Arijit Raychowdhury, Georgia Tech
Lixin Zhang, Chinese Academy of Sciences
Alper Buyuktosunoglu, IBM
1.3 Analog, MEMS, Mixed Signal and Imaging Electronics
Yogesh Ramadass, Texas Instruments (
subcommittee chair
)
Rajeevan Amirtharajah, UC Davis
Byunghoo Jung, Purdue University
Peter Levine, University of Waterloo
Lei Wang, University of Connecticut
David Wentzlof, University of Michigan
Roozbeh Jafari, UT Dallas
Jie Gu, Maxlinear
2. Design Tools, System and Software Design
2.1 CAD & Design Tools
David Pan, UT Austin (
subcommittee co-chair
)
Ruchir Puri, IBM (
subcommittee co-chair
)
Domenik Helms, OFFIS Research Institute
Jiang Hu, Texas A&M University
Taemin Kim, Intel
Yongpan Liu, Tsinghua University
Enrico Macii, Politecnico di Torino
Renu Mehra, Synopsys
Mustafa Ozdal, Intel
2.2 System Design and Methodologies
Naehyuck Chang, Seoul National University (
subcommittee co-chair
)
Massimo Poncino, Politecnico di Torino (
subcommittee co-chair
)
Elaheh Bozorgzadeh, UC Irvine
Deming Chen, University of Illinois at Urban-Champaign
Tohru Ishihara, Kyoto University
Rakesh Kumar, University of Illinois at Urbana-Champaign
Seok-Jun Lee, Texas Instruments
Qinru Qiu, Syracuse University
Li Shang, University of Colorado at Boulder
Mithuna Thottethodi, Purdue University
Yu Wang, Tsinghua University
Chia-Lin Yang, National Taiwan University
Xiangyu Dong, Qualcomm
David Atienza, EPFL
Jason Xue, City University of Hong Kong
Hao Yu, Nanyang Technological University Singapore
2.3 Software Design and Optimization
Vijay Raghunathan, Purdue University (
subcommittee co-chair
)
Vivek Tiwari, Intel (
subcommittee co-Chair
)
Yiran Chen, University of Pittsburgh
Ann Gordon-Ross, University of Florida
Yao Guo, Peking University
Zili Shao, Polytechnic University of Hong Kong
Michael Wrinn, Intel
Conference
Final Program (PDF)
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Transportation Guide
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For Committee Only
TPC Meeting Information
Design Contest
Call for Design Contest
Submission
Dates
Submission site to open
Mar. 01
Abstract Registration
Mar. 22
Paper Submission
Mar. 29
Accept/Reject Notification
May 20
Design Contest Deadline
Jun. 12
Camera-ready and Author Registration
Jun. 27
Advance Registration
Deadline
Aug. 1
Hotel Resevation
Deadline
Aug. 8
Conference
Sep. 4
to
Sep. 6