You could also download the PDF version.

Update (2013/03/07): Deadline exteneded! Abstract registration: March 22, Friday, 11:59PM (GMT-11); Full paper: March 29, Friday, 11:59PM (GMT-11).

Update (2013/03/02): Please make sure your submission uses IEEE Transactions/Conference format, instead of ACM format as posted earlier.

Sponsored IEEE Circuits and Systems Society and by (pending) ACM SIGDA and with technical support from the IEEE Solid-State Circuits Society, the IEEE Electron Devices Society, IPSJ Computer Science Society, and the IEICE Electronics Society.

The International Symposium on Low Power Electronics and Design (ISLPED) is the premier forum for presentation of recent advances in all aspects of low power design and technologies, ranging from process and circuit technologies, simulation and synthesis tools, to system level design and optimization. Specific topics include, but are not limited to, the following two main areas, each with three sub-areas:

1. Architecture, Circuits and Technology

1.1. Technologies and Digital Circuits
Emerging logic/memory technologies and applications; Low power device and interconnect design; Low power low leakage circuits; Memory circuits; 3-D technologies; Cooling technologies; Battery technologies; Variation-tolerant design; Temperature-aware and reliable design.
1.2. Logic and Microarchitecture Design
Processor core design; Cache and register file design; Memory Architectures; Logic and RTL design; Arithmetic and signal processing circuits; Encryption technologies; Asynchronous design.
1.3. Analog, MEMS, Mixed Signal and Imaging Electronics
RF circuits; Wireless; MEMS circuits; AD/DA Converters; I/O circuits; Mixed signal circuits; Imaging circuits; Circuits to support emerging technologies and platforms; DC-DC converters.

2. Design Tools, System and Software Design

2.1. CAD & Design Tools
Energy estimation and optimization tools that operate at the physical, circuit/gate level, RT level, behavioral level, and algorithmic levels; Links to other metrics: variability, reliability, temperature.
2.2. System Design and Methodologies
Microprocessor, DSP and embedded systems design; FPGA and ASIC designs; System-level power- and thermal-aware design; System-level reliability- and variability-aware design; Systems for Emerging applications
2.3. Software Design and Optimization
Power- and thermal-aware software design, scheduling, and management; Application-level optimizations; Wireless and sensor networks; Software for emerging applications.

Submissions on new topics: emerging technologies, architectures/platforms, and applications are particularly encouraged.

TECHNICAL PAPER SUBMISSIONS DEADLINE: Abstract registration: March 22, Friday, 11:59PM (GMT-11); Full paper: March 29, Friday, 11:59PM (GMT-11).

Submissions should be full-length papers of up to 6 pages (double-column, IEEE Transactions Conference format, available at template download), including all illustrations, tables, references and an abstract of no more than 100 words. Papers exceeding the six-page limit will not be reviewed. Submission must be anonymous: papers identifying the authors and/or with explicit references to their prior work will be automatically rejected. Electronic submission in pdf format only via the web is required.

Submitted papers must describe original work that will not be announced or published prior to the Symposium and that is not being considered or under review by another conference at the same time. Accepted papers will be presented in one of two parallel tracks: one focusing on architectures, circuits and technologies, the other on design tools and systems and software design for low power. Notification of paper acceptance will be mailed by May 20, 2013 and the camera-ready version of the paper will be due by June 20, 2013. Accepted papers will be published in the Symposium Proceedings and included in the IEEE Xplore and ACM Digital Library. Authors of a few selected papers from the Symposium will also be given an opportunity to submit enhanced versions of their papers for publication in a special issue of a reputed journal. ISLPED’13 will present two Best Paper Awards based on the ratings of reviewers and an invited panel of judges.


There will be several invited talks by industry and academic thought leaders on key issues in low power electronics and design. All invited talks will be in plenary sessions. The Symposium may also include embedded tutorials to provide attendees with the necessary background to follow recent research results, as well as panel discussions on future directions and design/technology alternatives in low power electronics and design. Proposals for invited talks, embedded tutorials, and the panel should be sent to the Technical Program Chairs:

Yuan Xie Penn State / AMD Research
Tanay Karnik Intel Labs

People from Industry or Academia interested in exhibiting at the Symposium should contact General Chairs by 5/20/2013