Committees

 

Organizing Committee

 

General Co-chairs

Ingrid Verbauwhede

UCLA

ingrid@ee.ucla.edu

 

Hyung Roh

Samsung

shlroh@samsung.co.kr

 

Program Co-chairs

Rajiv Joshi

IBM

rvjoshi@us.ibm.com

 

Kiyoung Choi

Seoul National University

kchoi@azalea.snu.ac.kr

 

Treasurer

 Vijay Narayanan

Penn State University

vijay@cse.psu.edu

Publicity Chair 

Luca Benini

Università di Bologna

lbenini@deis.unibo.it

Local Arrangements Chair 

Jihong Kim

Seoul National University

jihong@davinci.snu.ac.kr

 

 

Design Contest Chair

Vivek Tiwari

Intel Corporation

vivek.tiwari@intel.com

Exhibits Chair

Diana Marculescu

Carnegie Mellon University

dianam@ece.cmu.edu

 

   

 

Executive Committee

 

 

 

B. Barton, Texas Instruments

D. Blaauw, Univ. of Michigan

R. Brodersen, UC Berkeley

A. Chandrakasan, MIT

E. Cheng, Synopsys

J. Cong, UCLA

G. DeMicheli, Stanford

V. De, Intel Corporation

C. Enz, CSEM

M. J. Irwin, Penn State Univ.

E. Macii, Poli di Torino

F. Najm, University of Toronto

M. Pedram, USC

C. Piguet, CSEM

J. Rabaey, UC Berkeley

T. Sakurai, Univ. of Tokyo

C. Svensson, Linkoping Univ.

 

 

 

Technical Program Committee

 

 

 

1.1 Technology & Digital Circuits

 

 

Chair K. Roy, Purdue University

 

 

S.-I. Chae, Seoul National University

J. Figueras, Universitat Politecnica De Catalunya

W. Hwang, National Chiao Tung University

A. Inoue, Fujitsu Lab. Ltd.

A. Keshavarzi, Intel Corporation

L.-S. Kim, Kaist

T. Kuroda, Keio University

H. Makino, Mitsubishi Electric Corporation

H. Mizuno, Hitachi, Ltd.

T. Sakurai, Univ. of Tokyo

D. Scott, Texas Instruments

L. Svensson, Chalmers University

N. Tzartzanis, Fujitsu Laboratories of America

H.-S. Won, Samsung Electronics Co., Ltd.

 

1.2 Logic and Microarchitecture Design

 

 

Chair S. Kosonocky, IBM T. J. Walson Research Center

 

 

J. Arends, Motorola Inc.

I. Bahar, Brown University

S. Chakradhar, NEC Laboratories

B. Falsafi, Carnegie Mellon University

D. Garrett, Lucent Technologies

S. Kim, IBM T. J. Watson Research Center

S.-D. Kim, Yonsei University

P. Kogge, Univ. of Notre Dame

A. Kornfeld, Intel Corporation

L.-H. Lee,  Motorola Inc.

K. Muhammad, Texas Instruments

V. Oklobdzija, University of California

M. R. Stan, University of Virginia

J. Sparso, Technical University of Denmark

J. Tierno, IBM T. J. Watson Research Center

 

1.3 Analog, MEMS and Mixed Signal Electronics

 

 

Chair S. Mukherjee, Philips Research USA

 

 

L. Breems, Philips Research

B. Brodersen, University of California, Berkeley

K. Kornegay, Cornell University

S. Mattisson, Ericsson Mobile Platforms AB

K. Najafi, University of Michigan

S. Narendra, Intel Corporation

H.-J. Park, POSTECH

C.A.T Salama, University of Toronto

F. Yamaguchi, Sony Corporation

 

2.1 Simulation and Estimation Tools

 

 

Chair E. Cheng, Synopsys Inc.

 

 

A. Bogliolo, University of Urbino

Y. Cao, Kyushu University

J. Henkel, NEC Corporation

E. Huijbregts, Magma Design Automation Inc.

Y.-H. Kim, POSTECH

J.-T. Kong, Samsung Electronics Co., Ltd.

M. Martonosi, Princeton University

R. Marculescu, Carnegie Mellon University

W. Nebel, Carl Von Ossietzky Universitat Oldenburg

R. Panda, Motorola Inc.

B. M. Pangrle, Synopsys Inc.

V. Tiwari, Intel Corporation

 

2.2 Physical Design, Synthesis and Optimization Tools

 

 

Chair R. Mehra, Synopsys Inc.

 

 

J.-D. Cho, SungKyunKwan University

K.-M. Choi, Samsung Electronics Co., Ltd.

J. Cong, UCLA

M. Nemani, Intel Corporation

M. Poncino, Universita' di Verona

G. Stamoulis, University of Thessaly

K. Usami, Shibaura Institute of Technology

H. Yasuura, Kyushu University

R. Zafalon, STMicroelectronics

 

2.3 System and Software Design

 

 

Chair L. Benini, University of Bologna

 

 

K. van Berkel, Philips Research

C. Chakrabarti, Arizona State University

N.-H. Chang, Seoul National University

P. Chou, University of California, Irvine

N. Dutt, University of California, Irvine

M. Kandemir, Pennsylvania State University

H.-N. Kim, Electronics and Telecommunications Research Institute

E. Macii, Politecnico di Torino

B. Mangione-Smith, UCLA

D. Marculescu, Carnegie Mellon University

V. Narayanan, Pennsylvania State University

G.-H. Park, Samsung Electronics Co., Ltd.

C. Schurgers, Massachusetts Institute of Technology

Y.-S. Shin, IBM T. J. Watson Research Center

M. Srivastava, UCLA