for Papers (PDF)
INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGN
Portland, Oregon, USA
August 27-29 2007
Sponsored by ACM SIGDA and IEEE Circuits and Systems Society with technical co-sponsorship from the IEEE Solid-State Circuits Society and the IEEE Electron Devices Society.
The International Symposium on Low Power Electronics and Design (ISLPED) is the premier forum for presentation of recent advances in all aspects of low power design and technologies, ranging from process and circuit technologies, simulation and synthesis tools, to system level design and optimization. Specific topics include, but are not limited to, the following two main areas, each with three sub-areas:
1.1. Technologies and Digital Circuits: emerging logic & memory technologies and applications, device design, low power low leakage circuits, memory circuits, cooling technologies, battery technologies, variation-tolerant design, temperature-aware and reliable design
and Microarchitecture Design: processor core
design, cache design, logic and RTL
design, Arithmetic and signal processing circuits, encryption
technologies, asynchronous design
MEMS and Mixed Signal Electronics: RF circuits, Wireless, MEMS
circuits, AD/DA, converters, mixed-signal circuits, DC-DC conversion
System Design and Methodologies: microprocessor,
DSP and embedded systems design, FPGA and ASIC designs , emerging
applications, server thermal management, system level power management,
Behavioral and system level design aids
Design and Optimization: power aware compiler and operating system
design, application level optimizations, wireless and sensor networks
Submissions on new topics: emerging technologies, architectures/platforms, and applications are particularly encouraged.
Submissions should be full-length papers of up to 6 pages (double-column format, font size 9pt to 10pt), including all illustrations, tables, references and an abstract of no more than 100 words. Papers exceeding the six-page limit will not be reviewed. Electronic submission in pdf format only via the web is required. More information on electronic submission to ISLPED 07 can be found at http://www.islped.org.
papers must describe original work that will
not be announced or published prior to the Symposium and that is not
being considered or under review by another conference at the same
Accepted papers will be presented in one of two parallel
tracks: one focusing on architectures, circuits and technologies, the
design tools and systems and software design for low power.
paper acceptance will be mailed by May 10, 2007 and the
camera-ready version of the paper will be due
by May 30, 2007. Accepted papers
will be published in the Symposium Proceedings and included in the
SIGDA CD-ROM Publication Compendium. Authors of a few selected papers
Symposium will also be given an opportunity to submit enhanced versions
their papers for publication in a special issue of a reputed journal.
will present two Best Paper Awards based on the ratings of reviewers
invited panel of judges.
INVITED TALK, PANEL, AND TUTORIAL PROPOSALS DEADLINE: RECEIVED by April 15, 2007.
talks by industry and academic leaders on key issues in low power
and design. All invited talks will be in plenary sessions. The
may include embedded tutorials to provide attendees with the
necessary background to follow recent research results, as well
as panel discussions on future directions and design/technology
low power electronics and design. Proposals for invited talks, embedded
tutorials, and the panel should be sent to:
Companies interested in exhibiting at the Symposium should contact the Exhibits Chair by May 30, 2007.Executive Committee and Symposium Officers
Carnegie Mellon University
dianam @ ece.cmu.edu
NEC Labs America
anand @ nec-labs.com
Penn State University
vijay @ cse.psu.edu
University of California, Irvine
givargis @ uci.edu
Fujitsu Labs. of America
farzan @ fla.fujitsu.com
ravikumar @ ti.com
Reiner Hartenstein (Europe)
hartenst @ rhrk.uni-kl.de
Seoul Natl. Univ.
jihong @ davinci.snu.ac.kr
Portland State University
jeske @ ece.pdx.edu
pangrle @ atrenta.com
University of Karlsruhe
henkel @ informatik.uni-karlsruhe.de
yunglu @ purdue.edu
Other Members of the Executive Committee:
Barton, Texas Instruments
D. Blaauw, Univ. of Michigan
R. Brodersen, UC Berkeley
A. Chandrakasan, MIT
J. Cong, UCLA
V. De, Intel Corporation
G. DeMicheli, EPFL
C. Enz, CSEM
M. J. Irwin, Penn State Univ.
R. Joshi, IBM
E. Macii, Poli di Torino
F. Najm, University of Toronto
W. Nebel, Oldenberg U.
M. Pedram, USC
C. Piguet, CSEM
K. Roy, Purdue University
T. Sakurai, Univ. of Tokyo
M. Stan, U. of Virginia
C. Svensson, Linkoping Univ.
V. Tiwari, Intel Corp.
I. Verbauwhede, K.U.Leuven