ConferenceChair:

Enrico Macii

Politecnico di Torino
enrico@athena.polito.it

Technical Program Co-Chairs:

Vivek De

Intel Corporation
vivek.de@intel.com

Mary Jane Irwin

Penn State University
mji@cse.psu.edu

1.1 Technology & Digital Circuits:

    Chair

Takayasu Sakurai

University of Tokyo
tsakurai@iis.u-tokyo.ac.jp

    Members

Kaushik Roy

Purdue University
kaushik@ecn.purdue.edu
 

Anantha Chandraskasan

MIT
anantha@mtl.mit.edu
 

Thucydides (Duke) Xanthopoulos

MIT
duke@mtl.mit.edu
 

Rajiv Joshi

IBM T. J. Watson Res. Center
rvjoshi@us.ibm.com
 

Tadahiro Kuroda

Keio University
kuroda@elec.keio.ac.jp
 

Brock Barton

Texas Instruments
barton@ti.com
 

Murli Tirumala

Desktop Arcitecture Lab, Intel Corp
murli.tirumala@intel.com
 

Jim Burr

Sun Microsystems
jim.burr@eng.sun.com

1.2 Logic and Microarchitecture Design:

    Chair
 

Bill Bowhill

Compaq
Bill.Bowhill@compaq.com

    Members:

Mircea R. Stan

University of Virginia
mircea@virginia.edu
 

NVojin G. Oklobdzija

Integration Corp.
vojin@integration-corp.com
 

John P. Shen

Intel Corporation
john.shen@intel.com
 

Peter M. Kogge

Univ. of Notre Dame
kogge@cse.nd.edu
 

John Arends

Motorola
John.Arends@motorola.com
 

Stephen Kosonocky

IBM, T.J. Watson Research Center
stevekos@us.ibm.com
 

Kees van Berkel

kees.van.berkel@philips.com
 

Donald Steiss

Mindspring
d-steiss@ti.com

1.3 Analog, MEMS and Mixed-Signal Electronics:

    Chair
 

Mehmet Soyuer

IBM T.J. Watson Research Center
soyuer@us.ibm.com

    Members:

Sven Mattisson

Ericsson Mobile Communications AB
sven.mattisson@ecs.ericsson.se
 

Christian Enz

CSEM SA
christian.enz@csem.ch
 

Bob Brodersen

Berkeley Wireless Research Center
rb@bwrc.eecs.berkeley.edu
 

Vladim Gutnik

gutnik@silabs.com
 

Khalil Najafi

Univ. of Michigan
najafi@umich.edu
 

Satyen Mukherjee

Microelectronic Devices, Circuits and Systems Philips Research
satyen.mukherjee@philips.com

Chih-Kong Ken Yang

Univ. of California, Los Angeles
yang@ee.ucla.edu
 

Dr. Henry Baltes

ETH Zurich
baltes@iqe.phys.ethz.ch

2.1 Simulation and Estimation Tools:

    Chair
 

Edmund K. Cheng

Synopsys, Inc.
edcheng@synopsys.com

    Members:

Rajendran Panda

Motorola
Rajendran.Panda@motorola.com
 
 

Radu Marculescu

Carnegie Mellon University
radum@ece.cmu.edu
 

Vivek Tiwari

Intel Corporation
Vivek.Tiwari@intel.com
 

Margaret Martonosi

Princeton University
mrm@ee.princeton.edu
 

Alessandro Bogliolo

DI - University of Ferrara
abogliolo@deis.unibo.it
 

Joerg Henkel

C&C Research Labs, NEC USA, Inc.
henkel@ccrl.nj.nec.com
 

Ed Huijbregts

Magma Design Automation B.V.
ed@magma-da.com

 

2.2 Physical Design, Synthesis and Optimization Tools:

    Chair
 

Giovanni De Micheli

Gates Computer Science
nanni@stanford.edu

    Members:

Hiroto Yasuura

Kyushu University
yasuura@c.csce.kyushu-u.ac.jp
 
 

Mahadev Nemani

Intel Corporation
mahadev.nemani@intel.com
 

Jason Cong

University of California, Los Angeles
cong@cs.ucla.edu
 

Massimo Poncino

Politecnico di Torino - DAI
poncino@athena.polito.it
 

Renu Mehra

Synopsys Inc.
renu@synopsys.com
 

Roberto Zafalon

STMicroelectronics
roberto.zafalon@st.com
 

George Stamoulis

Intel Israel Ltd.
georgios.i.stamoulis@intel.com
  2.3 System and Software Design:

    Chair
 

Ingrid Verbauwhede

University of California, Los Angeles
ingrid@ee.ucla.edu

    Members:

Mahmut Kandemir

Penn State Dept. of CSE
kandemir@cse.psu.edu
 
 

Francky Catthoor

IMEC
catthoor@imec.be
 

Babak Falsafi

Carnegie Mellon University
babak@ece.cmu.edu
 

Kimiyoshi Usami

Toshiba Corporation Semiconductor Company
kimiyoshi.usami@toshiba.co.jp
 

Christian Piguet

CSEM
christian.piguet@csemne.ch
 

Chih-Shun Ding

Conexant Systems
chihshun.ding@conexant.com
 

Luca Benini

DEIS Universita di Bologna
lbenini@deis.unibo.it
 

Carla Ellis

Duke University
carla@cs.duke.edu
 

Chaitali Chakrabarti

Arizona State University
chaitali@asu.edu