ISLPED 2004 Committees

Committees
Organizing Committee
	General Co-chairs Rajiv Joshi IBM rvjoshi@us.ibm.com	Kiyoung Choi Seoul National University kchoi@azalea.snu.ac.kr
	Program Co-chairs Kaushik Roy Purdue University kaushik@ecn.purdue.edu	Vivek Tiwari Intel Vivek.tiwari@intel.com
	Treasurer Vijay Narayanan Penn State University vijay@cse.psu.edu	Publicity Chair Mahmut Kandemir Penn. State kandemir@cse.psu.edu Jihong Kim (Asian publicity) Seoul Natl. Univ. jihong@davinci.snu.ac.kr	Local Arrangements Chair Payam Heydari UC-Irvine payam@ece.uci.edu
	Design Contest Chair David Scott Texas Instruments david.scott@ti.com	Exhibits Chair Diana Marculescu Carnegie Mellon University dianam@ece.cmu.edu
Executive Committee
	B. Barton, Texas Instruments D. Blaauw, Univ. of Michigan R. Brodersen, UC Berkeley A. Chandrakasan, MIT E. Cheng, Synopsys J. Cong, UCLA G. DeMicheli, Stanford V. De, Intel Corporation C. Enz, CSEM	M. J. Irwin, Penn State Univ. E. Macii, Poli di Torino F. Najm, University of Toronto I. Verbauwhede, UCLA M. Pedram, USC C. Piguet, CSEM J. Rabaey, UC Berkeley T. Sakurai, Univ. of Tokyo
Technical Program Committee
	1.1 Technology & Digital Circuits
	Chair Ali Keshavarzi, Intel Corporation
	Takayasu Sakurai, Univ. of Tokyo David Scott, Texas Instruments Tadahiro Kuroda, Keio University Nestoras Tzartzanis, Fujitsu Lab. America Dennis Sylvester, Univ. of Michigan, Ann Arbor Sreedhar Natarajan, Intel Corporation Anantha Chandrakasan, MIT Vojin Oklobdzija, Univ. of California, Davis Wei Hwang, National Chiao Tung University
	1.2 Logic and Microarchitecture Design
	Chair Steve Kosonocky, IBM T. J. Watson Research Center
	Mircea Stan, University of Virginia Vamsi Srikantam, Agilent Technologies Trevor Mudge, Univ of Michigan, Ann Arbor Suhwan Kim, IBM T. J. Watson Research Center David Brooks, Harvard University Khurram Muhammad, Texas Instruments David Garrett, Lucent Technologies Srimat Chakradhar, NEC Laboratories, USA M. Balakrishnan, IIT, Delhi Dinesh Somasekhar, Intel Corporation Alice Wang, Texas Instruments
	1.3 Analog, MEMS and Mixed Signal Electronics
	Chair Satyen Mukherjee, Philips Research USA
	Kevin Kornegay, Cornell University Bob Brodersen, University of California, Berkeley Sven Mattisson, Ericsson Mobile Platforms AB Gu-Yeon Wei, Harvard University Siva Narendra, Intel Corporation Futao Yamaguchi, Sony Corporation Lucien Breems, Philips Research Peyam Hedari, Univ. of California, Irvine
	2.1 Simulation and Estimation Tools
	Chair Madhab Nemani, Intel Corp.
	Ed Cheng, Synopsys Inc. Radu Marculescu, Carnegie Mellon University Ed Huijbregts, Magma Design Automation Inc. Joerg Henkel, NEC Corporation M. Kandemir, Penn State University Wolfgang Nebel, Carl Von Ossietzky Universitat Oldenburg Yun Cao, Kyushu University Jeong-Taek Kong, Samsung Electronics Co., Ltd. Barry Pangrle, Synopsys Inc. Iris Bahar, Brown University
	2.2 Physical Design, Synthesis and Optimization Tools
	Chair Enrico Macii, Politecnico di Torino.
	Jason Cong, UCLA Massimo Poncino, Universita' di Verona Lei He, UCLA Kimiyoshi Usami, Shibaura Institute of Technology Kyumyung Choi, Samsung Electronics Co., Ltd. Jose Tierno, IBM T. J. Watson Research Center Naehyuck Chang, Seoul National University Pai Chou, Univ. of Irvine, California Mani Srivastava, UCLA Naresh Shanbhag, Univ. of Illinois, Urbana-Champaign George Stamoulis, University of Thessaly
	2.3 System and Software Design
	Chair D. Marculescu, Carnegie Mellon University
	Luca Benini, University of Bologna Jihong Kim, Seoul National University Chaitali Chakrabarti, Arizona State University Bill Mangione-Smith, UCLA Vijaykrishnan Narayanan, Penn State University Youngsoo Shin, IBM T. J. Watson Research Center Anand Raghunathan, Nec Laboratories Nikil Dutt, Univ. of California, Irvine Nagarajan Ranganathan, Univ. of South Florida