Call for Papers (PDF)

Portland, Oregon, USA
August 27-29 2007


Sponsored by ACM SIGDA and IEEE Circuits and Systems Society with technical co-sponsorship from the IEEE Solid-State Circuits Society and the IEEE Electron Devices Society.

The International Symposium on Low Power Electronics and Design (ISLPED) is the premier forum for presentation of recent advances in all aspects of low power design and technologies, ranging from process and circuit technologies, simulation and synthesis tools, to system level design and optimization. Specific topics include, but are not limited to, the following two main areas, each with three sub-areas:

1. Architecture, Circuits, and Technology 

1.1. Technologies and Digital Circuits: emerging logic & memory technologies and applications, device design, low power low leakage circuits, memory circuits, cooling technologies, battery technologies, variation-tolerant design, temperature-aware and reliable design

1.2. Logic and Microarchitecture Design: processor core design, cache design, logic and RTL design, Arithmetic and signal processing circuits, encryption technologies, asynchronous design

1.3. Analog, MEMS and Mixed Signal Electronics: RF circuits, Wireless, MEMS circuits, AD/DA, converters, mixed-signal circuits, DC-DC conversion

2. Design Tools, System and Software Design

2.1. Design Tools: energy simulation and estimation tools that operate at the circuit/gate level, RT level, behavioral level, and algorithmic level, variation-aware design, physical design and interconnects

2.2. System Design and Methodologies: microprocessor, DSP and embedded systems design, FPGA and ASIC designs , emerging applications, server thermal management, system level power management, Behavioral and system level design aids

2.3. Software Design and Optimization: power aware compiler and operating system design, application level optimizations, wireless and sensor networks

Submissions on new topics: emerging technologies, architectures/platforms, and applications are particularly encouraged.

 TECHNICAL PAPER SUBMISSIONS DEADLINE:  Full papers should be received by March 02, 2007 (no further extension).

Submissions should be full-length papers of up to 6 pages (double-column format, font size 9pt to 10pt), including all illustrations, tables, references and an abstract of no more than 100 words. Papers exceeding the six-page limit will not be reviewed. Electronic submission in pdf format only via the web is required. More information on electronic submission to ISLPED 07 can be found at  

Submitted papers must describe original work that will not be announced or published prior to the Symposium and that is not being considered or under review by another conference at the same time. Accepted papers will be presented in one of two parallel tracks: one focusing on architectures, circuits and technologies, the other on design tools and systems and software design for low power. Notification of paper acceptance will be mailed by May 10, 2007 and the camera-ready version of the paper will be due by May 30, 2007. Accepted papers will be published in the Symposium Proceedings and included in the annual ACM SIGDA CD-ROM Publication Compendium. Authors of a few selected papers from the Symposium will also be given an opportunity to submit enhanced versions of their papers for publication in a special issue of a reputed journal. ISLPED’07 will present two Best Paper Awards based on the ratings of reviewers and an invited panel of judges.


There will be several invited talks by industry and academic leaders on key issues in low power electronics and design. All invited talks will be in plenary sessions. The Symposium also may include embedded tutorials to provide attendees with the necessary background to follow recent research results, as well as panel discussions on future directions and design/technology alternatives in low power electronics and design. Proposals for invited talks, embedded tutorials, and the panel should be sent to:

Ali Keshavarzi
Intel Corp.
Portland, OR
ali.keshavarzi @

Vijay Narayanan
Penn State University
University Park, PA
vijay @

Companies interested in exhibiting at the Symposium should contact the Exhibits Chair by May 30, 2007.

Executive Committee and Symposium Officers  

General Co-Chairs:
        Diana Marculescu
        Carnegie Mellon University
        dianam @

        Anand Raghunathan
        NEC Labs America
        anand @

Program Co-Chairs:
        Ali Keshavarzi
        Intel Corp.

        Vijay Narayanan
        Penn State University
        vijay @

        Tony Givargis
        University of California, Irvine
        givargis @

Publicity Chairs:
        Farzan Fallah
        Fujitsu Labs. of America
        farzan @

        C. P. Ravikumar
        Texas Instruments
        ravikumar @

        Reiner Hartenstein (Europe)
        TU Kaiserslautern
        hartenst @

        Jihong Kim (Asia)
        Seoul Natl. Univ.
        jihong @

Local Arrangements Chair:
        Malgorzata Chrzanowska-Jeske
        Portland State University
        jeske @

Design Contest Chairs:
        Barry Pangrle
        pangrle @
        Joerg Henkel
        University of Karlsruhe
        henkel @

Exhibits Chair:
        Qing Wu
        SUNY University, Binghamton
        qwu @

Web Chair:
        Yung-Hsiang Lu
        Purdue University
        yunglu @

Other Members of the Executive Committee:

B. Barton, Texas Instruments
D. Blaauw, Univ. of Michigan
R. Brodersen, UC Berkeley
A. Chandrakasan, MIT
J. Cong, UCLA
V. De, Intel Corporation
G. DeMicheli, EPFL
C. Enz, CSEM
M. J. Irwin, Penn State Univ.
R. Joshi, IBM
E. Macii, Poli di Torino
F. Najm, University of Toronto
W. Nebel, Oldenberg U.
M. Pedram, USC
C. Piguet, CSEM
K. Roy, Purdue University
T. Sakurai, Univ. of Tokyo
M. Stan, U. of Virginia
C. Svensson, Linkoping Univ.
V. Tiwari, Intel Corp.
I. Verbauwhede, K.U.Leuven