Technical Program Committee

 



Technical Program Committee Co-Chairs

  • David Atienza, EPFL
  • Qinru Qiu, Syracuse University
  • Chris Nicol, Wave Computing

 

1. Technology, Circuits, and Architecture

 

1.1 - 1.2 Technologies and Circuits

  • • Swaroop Ghosh, Pennsylvania State Univ., Track Co-Chair
  • • Rahul Rao, IBM, Track Co-Chair
  • • Fady Abouzeid, ST Microelectronics
  • • Minki Cho, Intel
  • • Jie Gu
  • • Sumeet Gupta
  • • Sudhanshu Khanna, Texas Instruments
  • • Hae-Joon Kim, POSTECH
  • • Kannan Sankaragomathi, Verily Life Sciences
  • • Shreyas Sen
  • • Jae-sun Seo, Arizona State Univ.
  • • Aatmesh Shrivastava, Northeastern Univ.
  • • Amit Trivedi, Univ. of Illinois at Chicago
  • • Frank Gurkaynak, ETH Zurich
  • • Anupam Chattopadhyay, NTU
  • • Pascal Meinerzhagen, Intel
  • • Sidhartha Das, ARM
  • • Jungsun Park
  • • Aida Todri-Sanial, LIRMM
  • • Mehdi Tahoori, KIT
  • • Lei Zou, Microchip
  • • Ravi Sankar, INTEL
  • • Alexandre Levisse, EPFL
  • • Georgios Karakonstantis, QUB
  • • Vishal Khatri, IBM
  • • Mehdi Tahoori, KIT

 

1.3 Logic and Architecture

  • • Hai (Helen) Li, Duke Univ., Track Co-Chair
  • • Matthias Korb, ETH Zurich, Track Co-Chair
  • • Ron Dreslinski, Univ. of Michigan
  • • Jangwoo Kim, Seoul National Univ.
  • • Sandeep Navada, Qualcomm
  • • John (Jack) Sampson, Penn State Univ.
  • • Swagath Venkataramani, IBM
  • • Rangharajan Venkatesan, NVIDIA
  • • Antonia Zhai, Univ. of Minnesota
  • • Rakesh Kumar, Univ. of Illinois, Urbana Champaign
  • • Hsien-Hsin Lee, Facebook
  • • Giovanni Ansaloni, Univ. of Lugano (USI)
  • • Jongsoo Kim, ARM
  • • Daniel Wong, Univ. of California, Riverside
  • • Pierre-Emmanuel Gaillardon, Univ. of Utah
  • • Adam Teman, BIU
  • • Marisa Lopez-Vallejo, UPM
  • • Theo Theocharides, KIOS Center of Excellence
  • • Xin Fang, Qualcomm

2. CAD, Systems, and Software

 

2.1 CAD Tools and Methodologies

  • • Enrico Macii, Polytecnico di Torino, Track Co-Chair
  • • Mohamed Sabry, NTU, Track Co-Chair
  • • David Z. Pan, Univ. of Texas, Austin
  • • Yongpan Liu, Tsinghua Univ.
  • • Alberto Macii, Politecnico de Torino
  • • Hao Yu, Nanyang Technical Univ.
  • • Mathew Ziegler, IBM
  • • Davide Rossi, Univ. of Bologna
  • • Pascal Vivet, CEA-LETI
  • • Don Lee, Broadcom

 

2.2 Systems and Platforms

  • • Sheldon Tan, Univ. of California at Riverside, Track Co-Chair
  • • Naehyuck Chang, KAIST, Track Co-Chair
  • • Massimo Poncino, Politecnico di Torino
  • • Luca Carloni, Columbia Univ.
  • • Pai Chou, Univ. of California, Irvine
  • • Hun Seok Kim, Univ. of Michigan
  • • Younghyun Kim, Univ. of Wisconsin-Madison
  • • Umit Ogras, Arizona State Univ.
  • • Donghwa Shin, Princeton Univ.
  • • Jian-Jia Chen, TU Dortmund
  • • Marina Zapater, EPFL
  • • Jose L. Ayala, UCM
  • • Nele Mentes, KU Leuven
  • • Cristina Bolchini, Politecnico di Milano
  • • William Fornaciari, Politecnico di Milano

 

2.3 Software and Applications

  • • Pi-Cheng Hsiu, Academia Sinica, Track Co-Chair
  • • Amir Aminifar, EPFL, Track Co-Chair
  • • Nandhini Chandramoorthy, IBM
  • • Sung Woo Chung, Korea Univ.
  • • Kapil Dev
  • • Sherief Reda, Brown Univ.
  • • Yiran Chen, Duke Univ.
  • • Vivek Tiwari, Intel
  • • Edoardo Patti, Politecnico di Torino
  • • Weichen Liu, NTU Singapore
  • • Yuan-Hao Chang, Academia Sinica
  • • Ancy Molnos, CEA-LETI
  • • Miguel Peón Quirós, EPFL